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Heatsink Compound R-322
Trocad R-322 Heat Sink Compound is primarily used for Thermal coupling of electrical/electronic devices to heat sinks. It is applied to the base and mounting studs of transistors, diodes and silicon-controlled rectifiers. It maintains a positive heatsink seal that improves heat transfer from the electric/electronic device to the heatsink or chassis, thereby increasing overall efficiency of the device.
This product is also used as a high-voltage corona suppressant, nonflammable coating in connections for fly back transformers and TV sets and in aircraft engines where heat sinking properties are required.
Trocad Heatsink Compound is a grease like Silicone material, heavily filled with heat conductive metal oxides. This combination ensures high conductivity, low bleed and high temperature stability. The resulting compound will not dry out, harden or melt, even after long term exposure to temperature up to 392°F ( 200°C ). It maintains a positive heatsink seal that improves heat transfer from the electric/electronic device to the heatsink or chassis, thereby increasing overall efficiency of the device.
     
 
Thermal Pads T-177 / T-228
Trocad Thermally Conductive Insulators Pads are designed to be clean, grease free and flexible. The combination of a tough carrier material such as fiberglass and silicone rubber which is conformable, provides the engineer with a more versatile material than mica or ceramics and grease. T-Pads minimize the thermal resistance from the case of a power semiconductor to the heat sink. T-Pads electrically isolate the semiconductor from the heat sink and have sufficient dielectric strength to withstand high voltage. They are also tough to resist puncture by the facing metal surface.
T-177/T-228 Pads are ideally suitable where low thermal resistance and low cost are critical.

Trocad T-Pads are available in various TO outlines, in sheets or can be made to your outline drawing.

   
 
Thermal Pads T-250
Trocad Thermally Conductive Insulator Pads are designed to be clean, grease free and flexible. The combination of a tough carrier material such as fibreglass and thermally conductive silicone rubber which is conformable, provides the engineer with a more versatile material than mica or ceramics and grease. T-Pads minimize the thermal resistance from the case of a power semiconductor to the heat sink. T-Pads electrically isolate the semiconductor from the heat sink and have sufficient dielectric strength to withstand high voltage. They are also tough to resist puncture by the facing metal surface unlike plain silicone sheets.
T-250 Pads are ideally suitable where low thermal resistance and low cost are critical.

Trocad T-Pads are available in various TO outlines, in sheets or can be made to your outline drawing.
   
 
Phase Change Thermal Pads T-2000
• Low Thermal Impedance
• High Dielectric Strength
• High Cut Through Resistance
• 60°C Phase Change Temperature
Phase Change refers to the characteristics of the Thermal Compound used to transition or change to a fluid state and back to a solid state at predetermined temperatures. During the change to its fluid state the compound expands 15% in volume allowing it to move and wet both mounting surfaces and fill all interstitial voids between them. This eliminates airpockets, allowing maximum heat transfer. T-2000 is composed of a specialized heat conducting polyamide insulating substrate coated both sides with a proprietary phase change thermal compound that offers unique heat transfer advantages. The controlled flow permits conformal setting of the material. Wetting action eliminates voids due to mounting surface irregularity.
   
 
Thermal Pads Flexible Tubes
THERMALLY CONDUCTIVE • ELECTRICALLY INSULATING

The TT series of Thermally Conductive Flexible Tubes provide good thermal conduction and electrical insulation to Plastic Power devices. It is ideally suited for clip mounted power devices. It provides an efficient heat flow path from below and above heat generating components into adjoining heat spreaders.
T-pad tubes are made of silicon rubber with high thermal conductivity. The semi conductor is just inserted into the tube which provides an all round shroud. The tubes flexible wall accommodates most standard packages.

Trocad T-Pads are available in various TO outlines, in sheets or can be made to your outline drawing.

   
 
T-Clips
SUITABLE FOR MOUNTING SEMICONDUCTORS TO HEATSINKS

The use of pressure to mount discrete power semi-conductors has been rapidly growing. It has proven to be a cost effective technique and it can improve the overall performance of the discrete semiconductor. Trocad's T- Clips with a gull wing design offer a easy way of mounting two plastic case transistors in a small place. These T- Clips provide several advantages .
• T-Clips are quick mounting, space saving easy to apply and cost effective
• Allows plastic case transistors to operate at higher voltages than the traditional screw and insulating bush method. For   superior higher voltage breakdown protection the combination of clips and Thermal Tubes is an ideal solution.
• Application of force off-centre (i.e. bolting a device to heatsink) leads to uneven thermal contact being applied. Using clip   mounting ensures that the force is applied uniformly and that the thermal contact is good.
T-Clips are available in two Sizes TO-220 ( TO128,TO126, TO-218, ) and TO-3P ( TO247, SOT-93 ). They are Zinc plated. Nylon coating for improved insulation is an option but is expensive.
   
 
LOCTITE : Thermally Conductive Adhesive – 384
LOCTITE ® Product Output™ 384 is a repairable thermally conductive, one part room temperature Activator curing adhesive system designed for bonding heat generating components and heat sinks. The high thermal conductivity provides excellent heat dissipation for thermally sensitive components while the controlled strength permits field and service repairs. In high pot applications this product should be limited to a maximum of 500 volts.
TYPICAL APPLICATIONS

Bonding transformers, transistors and other heat generating electronic components to printed circuit board assemblies or heat sinks.
   
 
LOCTITE : Conformal Coatings
Conformal coatings are thin dielectric coatings that extend the longevity of circuit boards by protecting chips and traces from corrosion, shorts and mechanical damage. Loctite offers both Acrylic/Urethane and Silicone Conformal Coatings which are cured via UV, heat or two-part cure mechanisms.
PRODUCT FEATURES

• High dielectric strength
• Fast drying
• Precision spray nozzle • Contains no CFC's
3900 Aerosol Can

ShadowCure™ Type AR aerosol conformal coating is a clear acrylic formulated without chlorinated solvents or CFC's. The coating is spray-applied and air dries tack-free in five minutes to provide a tough environmental and solvent-resistant coating. This product withstands temperatures ranging from -40ºF to 257ºF (-40ºC to 125ºC).
   
 
     
   
     
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